Suresh Indu Lasers Private Limited
Suresh Indu Lasers Private Limited
Hadapsar, Pune, Maharashtra
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Laser Micro-machining System

Our product range includes a wide range of fiber laser micro-machining system.
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  • Fiber Laser Micro-Machining System
  • Fiber Laser Micro-Machining System
Fiber Laser Micro-Machining System
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Fiber Laser Micro-Machining System

Approx. Price: Rs 250 Lakh / PieceGet Latest Price
Product Details:
Minimum Order Quantity1 Piece
Laser Power45 W
Laser ModelAmplitude/ Coherent/Ekspla/OEM
work size600 x 300 / 300 x 300 mm with air bearing
Rotary Axis0 backlash up to 50 mm
Z Axis300 mm
Max Idle Speed5 m / sec
Linear Accearationl2.5 G
Power380/60 V/Hz

SIL Laser Micro-Machining System

Flexible design for all your micro machining requirements. The system configured as per your requirement.
2 D planar cutting with precision focus adjustment for dicing, stealth dicing or ceramic cutting
Accuracies up to 1micron for 100mm travel. Special air bearing slides for higher accuracies
Add rotary axis for micro tube machining
Add short focus planar Lens
Close loop scanner for submicron machining of precision parts
Add Trepanning for micro hole drilling from 0.25mm or lower up to 1mm.
Z axis available with positioning accuracies of 1 micron
CNC controller with 2 interpolated axis expandable to 6 axis interpolation.

· Amount of deposited material along the edges,
· width of damaged material along the edges,
· minimum structural dimensions,
· maximum ¿¿¿ank slope, smoothness of ¿¿¿anks and bottom



SIL Laser micromachining techniques are currently used by the automobile and
Medical industries as well as in the production of semiconductors and solar cell
Processing. SIL Lasers for micromachining offer a wide range of wavelengths, pulse duration (From femtosecond to microsecond) and repetition rates (from single pulse to
Megahertz). These attributes allow micromachining with high resolution in depth
And lateral dimensions. The ¿¿¿eld of micro-machining includes manufacturing methods like drilling, Cutting, welding as well as ablation and material surface texturing, whereby it is Possible to achieve very ¿¿¿ne surface structures ranging in the micrometer domain. Such processes require a rapid heating, melting and evaporation of the material. The use of extremely short nano- and pico- and even femtosecond pulse durations Helps to minimize the thermal effects such as melting and burr formation thus Eliminating the need for any post processing measures.


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